- September 2002 -

September 25th, 2002

3SAE Technologies takes part in optoelectronics packaging research

3SAE Technologies, Inc. in Boston, MA has taken part in an optoelectronics packaging research effort sponsored by an international consortium of photonics industry leaders. Universal Instruments Corporation, Flip Chip and Optoelectronics Packaging department in Binghamton, NY conducted the research.

As stated by Antonio Prats, Process Research Engineer at Universal Instruments Advanced Process / SMT Laboratory, "Universal Instruments is developing the experimental and theoretical means to assess the consequences of damage induced in optical fibers in handling and packaging.

3SAE's patented burst stripping technique appears to offer an advantage over traditional methods in terms of these. This was assessed by tensile testing of single mode fiber samples in Universal Instruments' process laboratory. One set of samples was stripped and cleaved using 3SAE's AutoPrep unit while another set of control samples was prepared using a conventional mechanical cleaver and thermo-mechanical stripper.

Both sets were then spliced and recoated using identical equipment and process parameters. Both the mean and the width of the strength distribution obtained for the control samples were similar to values usually obtained with these traditional methods.

The mean strength of fibers prepared with 3SAE's AutoPrep unit was over 50% higher and the standard deviation was less than half. Depending on the service conditions, the corresponding predicted mean life in service might be more than an order of magnitude larger."

Fiber preparation is one of the most critical elements in optical component manufacturing and outside plant fiber splicing. The process of stripping, cleaning and cleaving an optical fiber while maintaining maximum fiber strength is essential for producing long service life in optical components. 3SAE's burst stripping technique, which does away with the use of mechanical blades or ultrasonic chemical cleaning, sets a new standard in opto-electronics packaging and handling. In a further effort to improve outside plant field fiber splicing, 3SAE will incorporate this new technology into a low cost, compact field version in 2003.

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